Laser marking
ASYS INSIGNUM 4000 LASER
- Smallest module size: min. 0.127 mm / min. 5 mil
- Code quality controlled by integrated camera system
- Integrated flip-station
- Maximum precision
- 1D and 2D code capability
- CO2 10 W laser tube
Capabilities
Equipment built for precision and flexibility.
Our state of the art facility uses the latest SMT and THT equipment for assembling all types of boards: rigid, flex and rigid-flex.
- 8,000 m²
- Production area
- 250+
- BOM lines
- 2,500+
- Components per board
- 01005
- Smallest chip size
- 400+
- BGA balls
- 170 µm
- Smallest BGA ball
- 250 µm
- BGA pitch
- 0.1–5 mm
- Final PCB thickness
- 7 WD
- Lead time
Stencil printing
EKRA SERIO 5000
- Suitable for stencils up to 31 inch
- Print format up to 510 x 510 mm
- Cycle time: 7 s + print
- Print repeatability ±20 µm @ 6 Sigma
- Alignment repeatability ±12.5 µm @ 6 Sigma
- Closed loop with KohYoung 8030-2 3D SPI; automatic stencil cleaning
Stencil printing
ASMPT DEK NEOHORIZON 03iX
- Maximum print area: 510 x 508.5 mm
- Core cycle time: 8 s + process time
- Machine alignment capability: ±12.5 µm @ >2.0 Cmk
- System alignment capability: ±20 µm @ >2.0 Cmk
- Long Board option: substrates up to 620 x 508.5 mm
SPI
KOHYOUNG KY8030-2 3D
- 3D solder paste inspection
- Solves shadow problems by utilizing 2-way projection
- Accurate inspection data with real-time PCB warp compensation
- Closed loop with EKRA Serio 5000 for X, Y and Theta printing corrections
Pick&place
SIPLACE ASM SX1 & ASM SX2
- Placement machines with 3 CPP heads
- Minimum component size 01005
- Maximum component size 50 x 40 mm; 11.5 mm height
- Minimum lead pitch: 0.25 mm; minimum ball pitch: 0.25 mm
- Minimum lead width: 0.1 mm
- IPC placement rate: 57,000 components/hour; Setup Center verification
Vapor phase / Reflow system
ASSCON REFLOW OVEN VP7000
- Vapor phase soldering in a completely inert atmosphere - no N2 required
- No danger of overheating the component or PCB
- Vacuum process for void-free soldered joints
- OPC visual process control; minimum PCB dimensions 100 x 60 mm
Vapor phase / Reflow system
REFLOW SYSTEM ERSA HOTFLOW 3/20
- Excellent heat transfer with varied board assemblies
- Multi-level controlled cooling
- Multi-track conveyor system (1-4 tracks)
- Ersa Process Control (EPC) for continuous process monitoring
- N2 soldering atmosphere
Through hole soldering
ERSA VERSAFLOW 4/55
- High-end selective soldering system
- Processable area 20" x 20"
- Soldering module Y/Z variable
- Use of up to 4 flux spray heads
- Secure process control with monitoring of all relevant processes
- N2 soldering atmosphere
AOI
KOHYOUNG ZENITH 3D
- Full 3D automated optical inspection
- Removes shadow problems utilizing 8-way projection
- Perfect 3D solder joint inspection
- Accurate inspection data with real-time PCB warp compensation
- OCV and OCR for text and number recognition
XRAY
GE MICROMEX 180
- Temperature-stabilized digital DXR detector with active cooling for high-dynamic live imaging
- 180 kV / 20 W high-power micro-/nanofocus tube
- Up to 0.5 µm or 0.2 µm detail detectability
- Diamond window for up to 2x faster data acquisition at the same high image quality level
Inspection Test
TEST SYSTEM TAKAYA APT-1400F
- 4-head and 6-flying-probe system
- Single test: 0.05-0.06 sec/step
- Combination test: 0.02-0.03 sec/step
- 2D code reading ready
Depaneling
DEPANELING SYSTEM DIVISIO 5100 DUAL
- High-speed depaneling system
- 2D code reading ready
- Minimum PCB dimensions 50 x 50 mm
- Maximum PCB dimensions 450 x 450 mm
- Optical centering before depaneling for greater precision
Repair station
HYBRID REWORK SYSTEM ERSA HR 600/2
- Automatic desoldering, placement and soldering of SMT components
- Highly accurate, motor-driven axis system
- Fully automatic or semiautomatic operation
- PCB size from 20 x 20 to 390 x 285 mm
- Component size from 1 x 1 to 50 x 50 mm
Laser stencil production
LPKF STENCILLASER G 6080
- Working and cutting area: 600 x 800 mm
- Axis accuracy and repeatability: ±2 µm
- Maximum material thickness: 1 mm
- Cutting speed: up to 51,200 apertures/hour
- Maximum loose sheet: 650 x 850 mm
- Class 1 laser system; repetition rate up to 45 kHz
Component counting
SEAMARK X-RAY XC1000 COMPONENT COUNTER
- X-ray counting system for electronic components
- Supports reels, cut tape, trays and other compatible packaging formats
- Fast, non-destructive component quantity verification
- Integrated display and side printer for labels or counting reports
Stock & storage
Components Handling
We ensure the highest standards in component management, providing reliability and confidence to our partners:
- Passive Components
- A broad selection of passive components is readily available from our in-house stock, enabling fast response and uninterrupted production.
- Active Components
- Our experienced purchasing team sources active components efficiently, ensuring competitive pricing and timely delivery.
- ESD Protection
- All processes are carried out in a fully ESD-protected environment, safeguarding sensitive devices and guaranteeing product integrity.
- Dry Storage Chambers
- Moisture-sensitive components are preserved in specialized dry chambers, maintaining long-term stability and securing consistent quality for your assemblies.
With these measures, we guarantee that every component is handled with precision and care — ensuring smooth production flow and maximum reliability for our customers.
